AgNi Alloy As a Suitable Barrier Layer Material for NbFeSb-Based Half-Heusler Thermoelectric Modules

MLA

Weiqin Ao, et al. “AgNi Alloy As a Suitable Barrier Layer Material for NbFeSb-Based Half-Heusler Thermoelectric Modules.” Journal of Electronic Materials, vol. 48, Aug. 2019, pp. 6815–22. EBSCOhost, https://doi.org/10.1007/s11664-019-07514-x.

APA

Weiqin Ao, Jiaxu Zhu, Kunming Gu, Fusheng Liu, Lipeng Hu, Heping Xie, Bo Gong, Junqin Li, Chaohua Zhang, Xiao Wang, & Yu Li. (2019). AgNi Alloy As a Suitable Barrier Layer Material for NbFeSb-Based Half-Heusler Thermoelectric Modules. Journal of Electronic Materials, 48, 6815–6822. https://doi.org/10.1007/s11664-019-07514-x

Chicago

Weiqin Ao, Jiaxu Zhu, Kunming Gu, Fusheng Liu, Lipeng Hu, Heping Xie, Bo Gong, et al. 2019. “AgNi Alloy As a Suitable Barrier Layer Material for NbFeSb-Based Half-Heusler Thermoelectric Modules.” Journal of Electronic Materials 48 (August): 6815–22. doi:10.1007/s11664-019-07514-x.