Temperature Prediction on Flexible Printed Circuit Board in Reflow Oven Soldering for Motherboard Application

Authors :: M. Z. Abdullah
A. M. Iqbal
Mohd Sharizal Abdul Aziz
M. H. H. Ishak
Source :: IOP Conference Series: Materials Science and Engineering. 530:012019
Publication Year :: 2019
Publisher :: IOP Publishing, 2019.

Subjects :: Materials science
Reflow oven
Motherboard
Soldering
Mechanical engineering
Flexible electronics

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