Back to Search
Start Over
The Study of Dislocation Propagation in Si Wafer during IGBT High Thermal Budget Process
- Source :
- 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
- Publication Year :
- 2023
- Publisher :
- IEEE, 2023.
Details
- Database :
- OpenAIRE
- Journal :
- 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
- Accession number :
- edsair.doi...........9593c70ea060e4681c368fdfa0b44ebe
- Full Text :
- https://doi.org/10.1109/edtm55494.2023.10103031