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A Review of Low-Temperature Solders in Microelectronics Packaging

Authors :
Vidya Jayaram
Omkar Gupte
Karan Bhangaonkar
Chandrasekharan Nair
Source :
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13:570-579
Publication Year :
2023
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2023.

Subjects

Subjects :
Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

Details

ISSN :
21563985 and 21563950
Volume :
13
Database :
OpenAIRE
Journal :
IEEE Transactions on Components, Packaging and Manufacturing Technology
Accession number :
edsair.doi...........9420d011a47c9797f7c76a4565db6bd6

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