Enhanced Heat Transport Capability across Boron Nitride/Copper Interface through Inelastic Phonon Scattering

MLA

Jingjing Wang, et al. “Enhanced Heat Transport Capability across Boron Nitride/Copper Interface through Inelastic Phonon Scattering.” Advanced Functional Materials, vol. 32, July 2022, p. 2206545. EBSCOhost, https://doi.org/10.1002/adfm.202206545.

APA

Jingjing Wang, Ziyang Wang, Kunming Yang, Naiqi Chen, Jiamiao Ni, Jian Song, Quan Li, Fangyuan Sun, Yue Liu, & Tongxiang Fan. (2022). Enhanced Heat Transport Capability across Boron Nitride/Copper Interface through Inelastic Phonon Scattering. Advanced Functional Materials, 32, 2206545. https://doi.org/10.1002/adfm.202206545

Chicago

Jingjing Wang, Ziyang Wang, Kunming Yang, Naiqi Chen, Jiamiao Ni, Jian Song, Quan Li, Fangyuan Sun, Yue Liu, and Tongxiang Fan. 2022. “Enhanced Heat Transport Capability across Boron Nitride/Copper Interface through Inelastic Phonon Scattering.” Advanced Functional Materials 32 (July): 2206545. doi:10.1002/adfm.202206545.