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Molecular dynamics simulation of tin whisker growth in three-point bending copper-tin coating under multi-field coupling
- Source :
- Chemical Physics Letters. 811:140220
- Publication Year :
- 2023
- Publisher :
- Elsevier BV, 2023.
- Subjects :
- General Physics and Astronomy
Physical and Theoretical Chemistry
Subjects
Details
- ISSN :
- 00092614
- Volume :
- 811
- Database :
- OpenAIRE
- Journal :
- Chemical Physics Letters
- Accession number :
- edsair.doi...........919ccf1b70f6468f96efba3aa689b1df