Thick-film NTC thermistors and LTCC materials: The dependence of the electrical and microstructural characteristics on the firing temperature

The electrical and microstructural characteristics of 1 kΩ/sq. thick-film NTC thermistors (4993, EMCA Remex) fired either on LTCC (low-temperature cofired ceramic) substrates or buried within LTCC structures were evaluated. The thermistors were fired at different temperatures to study the influence of firing temperature on the electrical characteristics. The results were compared with the characteristics obtained on alumina substrates. The sheet resistivities were higher than the resistivities of thick-film thermistors on alumina substrates. The increase of the sheet resistivities was attributed to the diffusion of the glass phase from the rather glassy LTCC substrates into the NTC thermistors. This was confirmed by EDS analyses. However, the increase in the resistivity was linked to an increase of the beta factors. Therefore, the results show that the evaluated NTC thermistors on LTCC substrates can be used for temperature sensors in MCM-Cs as well as in MEMS LTCC structures. When the thermistors were buried in the LTCC substrates, the LTCC structures delaminated during firing, leading to high sheet resistivities and high noise indices. This delamination is attributed to the different sintering rates of the NTC and LTCC materials.