Cite

Scalable Chiplet package using Fan-Out Embedded Bridge

MLA

C. Key Chung, et al. “Scalable Chiplet Package Using Fan-Out Embedded Bridge.” 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), June 2020. EBSCOhost, https://doi.org/10.1109/ectc32862.2020.00015.



APA

C. Key Chung, Chun-Tang Lin, Ally Liao, Ying Ju Lu, Joe Lin, Jia Shuang Chen, & Daniel Ng. (2020). Scalable Chiplet package using Fan-Out Embedded Bridge. 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc32862.2020.00015



Chicago

C. Key Chung, Chun-Tang Lin, Ally Liao, Ying Ju Lu, Joe Lin, Jia Shuang Chen, and Daniel Ng. 2020. “Scalable Chiplet Package Using Fan-Out Embedded Bridge.” 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), June. doi:10.1109/ectc32862.2020.00015.