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Process and Structure Considerations for the Post FinFET Era

Authors :
Chun-Jung Su
Wen-Kuan Yeh
Wen-Fa Wu
Po-Jung Sung
Yao-Jen Lee
Kuo-Hsing Kao
Source :
2020 IEEE Silicon Nanoelectronics Workshop (SNW).
Publication Year :
2020
Publisher :
IEEE, 2020.

Abstract

Evolution of transistor structures, from planar, fin to gate-all-around (GAA) nanowire (NW)/nanosheet (NS), enables consecutive device scaling and performance boost. To further enhance the drive current per footprint, a vertically stacked configuration compatible with current CMOS technology may be a promising approach for extending Moore's Law. In this paper, we review the recent status of stacked FET architectures and beyond, as well as pointing out the challenges and perspectives.

Details

Database :
OpenAIRE
Journal :
2020 IEEE Silicon Nanoelectronics Workshop (SNW)
Accession number :
edsair.doi...........8dbecfc66c6e7ac86c5dcb96f93a2356
Full Text :
https://doi.org/10.1109/snw50361.2020.9131422