Back to Search Start Over

The Effect of a Si Capping Layer on RF Characteristics of High-$k$/Metal Gate SiGe Channel pMOSFETs

Authors :
Chang Yong Kang
Hsing-Huang Tseng
Raj Jammy
B.-G. Min
Chang Woo Sohn
Min Sang Park
Prashant Majhi
Jungwoo Oh
Gil-Bok Choi
Jeong-Soo Lee
Yoon-Ha Jeong
Jack C. Lee
Hyun Chul Sagong
Kyong Taek Lee
Source :
IEEE Electron Device Letters. 31:1104-1106
Publication Year :
2010
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2010.

Abstract

We present a comparative study of the effects of a Si capping layer on SiGe channel pMOSFETs used for radio-frequency (RF) applications. In Si-capped devices, the drive current increases because Si/SiGe heterojunction layers form a SiGe quantum well, which reduces carrier scattering. Conversely, SiGe samples without a Si capping layer suffer severe interface degradation, due to Ge diffusing into the gate dielectric. Devices using a Si capping layer have enhanced RF performance and reduced low-frequency noise, which is a key factor affecting phase noise. There is an increase in the RF figures of merit. These benefits indicate that a Si capping layer should be used in SiGe channel pMOSFETs.

Details

ISSN :
07413106
Volume :
31
Database :
OpenAIRE
Journal :
IEEE Electron Device Letters
Accession number :
edsair.doi...........8d10cb9a4d5093d543ee669d6ff432c6