Back to Search Start Over

Optimization of the Direct Diffusion Bonding Process Using Cu Stabilizing Layers of the REBCO Coated Conductors

Authors :
Seishiro Kato
Noriko Chikumoto
Source :
IEEE Transactions on Applied Superconductivity. 33:1-5
Publication Year :
2023
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2023.

Subjects

Subjects :
Electrical and Electronic Engineering
Condensed Matter Physics
Electronic, Optical and Magnetic Materials

Details

ISSN :
23787074 and 10518223
Volume :
33
Database :
OpenAIRE
Journal :
IEEE Transactions on Applied Superconductivity
Accession number :
edsair.doi...........8bf46cef4662d2adbfc0bcc4cd81315b
Full Text :
https://doi.org/10.1109/tasc.2023.3261839
Full Text Access
View/download PDF

Tools

Authors Abstract Subjects Details