Design of on-chip microwave filters in integrated fan-out wafer level packaging (InFO-WLP) technology

This paper investigates the microwave lowpass filters in integrated fan-out wafer-level packaging (InFO-WLP) technology. The Chebyshev prototype is adopted to achieve sharp cutoff at the edge of passband. A lumped-LC structure and three different distributed structures, including λ/8 stubs, stepped-impedance, and periodic tapered electromagnetic bandgap (EBG), are employed to find an appropriate microwave LPF realized in InFO-WLP technology. The simulation results exhibit the proposed LPF using lumped-LC structure can achieve the smallest size with the accepted ripple in passband and good suppression in stopband at the cutoff frequency of ∼ 10 GHz. To the best of authors' knowledge, this is the first to study microwave filters in InFO-WLP technology.