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The Dry Ashing and Etching Technology for Advanced Packaging

Authors :
Muneyuki Satou
Yasuhiro Morikawa
Ryuichiro Kamimura
Atsushi Okuda
Daisuke Hironiwa
Source :
Journal of The Japan Institute of Electronics Packaging. 24:536-540
Publication Year :
2021
Publisher :
Japan Institute of Electronics Packaging, 2021.

Details

ISSN :
1884121X and 13439677
Volume :
24
Database :
OpenAIRE
Journal :
Journal of The Japan Institute of Electronics Packaging
Accession number :
edsair.doi...........88a1073e32e51cc5137d2266fb9ce28b