Effect of Contact Angle on Meniscus Evolution and Contact Line Jump of Underfill Fluid Flow in Flip-Chip Encapsulation

Authors :: Mohd Hafiz Zawawi
Muhamed Abdul Fatah Muhamed Mukhtar
Fei Chong Ng
Mohamad Aizat Abas
Mohd Zulkifly Abdullah
Lun Hao Tung
Source :: CFD Letters. 12:28-38
Publication Year :: 2020
Publisher :: Akademia Baru Publishing, 2020.

Subjects :: Fluid Flow and Transfer Processes
Contact angle
Materials science
Modeling and Simulation
Contact line
Jump
Fluid dynamics
Composite material
Flip chip
Encapsulation (networking)

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