Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging

MLA

Takuma Katase, et al. “Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging.” Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), vol. 2014, Jan. 2014, pp. 001643–69. EBSCOhost, https://doi.org/10.4071/2014dpc-wp24.

APA

Takuma Katase, Kyouhei Mineo, Takeshi Hatta, Akihiro Masuda, Koji Tatsumi, & Masayuki Ishikawa. (2014). Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging. Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT), 2014, 001643–001669. https://doi.org/10.4071/2014dpc-wp24

Chicago

Takuma Katase, Kyouhei Mineo, Takeshi Hatta, Akihiro Masuda, Koji Tatsumi, and Masayuki Ishikawa. 2014. “Control of Bump Morphology in Lead Free Solder Plating for Higher Density Packaging.” Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014 (January): 001643–69. doi:10.4071/2014dpc-wp24.