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Surface wettability, surface free energy, and surface adhesion of microwave plasma-treated Pinus yunnanensis wood
- Source :
- Wood Science and Technology. 50:285-296
- Publication Year :
- 2015
- Publisher :
- Springer Science and Business Media LLC, 2015.
-
Abstract
- In this study, microwave plasma was used to treat the surface of Pinus yunnanensis wood under the conditions of 220 V of input voltage, 20 μA of filament current, 8.8 mW of output power, 11 mW of reflected power, 2450 MHz of frequency, and 700 Pa of vacuum. The microwave plasma presented very significant treatment effects on the treated surface, even under weak treatment conditions, for example long treatment distance of 120 mm and short treatment time of 60 s. The treated surface showed better surface wettability, and the contact angles on the treated surface measured from deionized water, glycerin, and diiodomethane decreased sharply, even decreased to 0°. The treated surface also presented higher surface free energy, for example, 61.4–62.8 mJ m−2, being greatly improved by microwave plasma compared to that of untreated surface of 46.5 mJ m−2. The bond strength of the treated surface was 7.34 MPa, about 16 % higher than 6.31 MPa for untreated surface. The best treatment effect was obtained for the treatment distance of 120 mm and treatment time of 60–300 s. This technique might be widely used in wood modification and wood processing.
- Subjects :
- 010302 applied physics
Pinus yunnanensis
Materials science
biology
Bond strength
Forestry
02 engineering and technology
Plant Science
Adhesion
021001 nanoscience & nanotechnology
biology.organism_classification
01 natural sciences
Industrial and Manufacturing Engineering
Ion source
Surface energy
Contact angle
chemistry.chemical_compound
chemistry
0103 physical sciences
General Materials Science
Diiodomethane
Wetting
Composite material
0210 nano-technology
Subjects
Details
- ISSN :
- 14325225 and 00437719
- Volume :
- 50
- Database :
- OpenAIRE
- Journal :
- Wood Science and Technology
- Accession number :
- edsair.doi...........85b855e673dfaa869f4f811074b87ced