Joining of Cf/SiC composite with Cu–Pd–V filler alloy and Mo interlayer

Cf/SiC composites were joined to itself with (and without) Mo interlayer at 1150 °C for 10 min by Cu–Pd–V filler metal. For two kinds of the joints, after the interfacial reactions, continuous V–C layers and dispersive V–C particles were formed at surface of the joined Cf/SiC composite. It was worth noting that much more dispersive particles were formed in case of Cf/SiC–Mo–Cf/SiC joint which was favorable to the Cf/SiC joint strength. Meanwhile, when adding a Mo interlayer in Cf/SiC joint, a continuously distributed (V, Mo)–Si compounds with high melting point was formed near the Mo interface, which can strengthen the joining interface and improve the high-temperature strength. As a consequence, the joint strength at room temperature was remarkably increased to 148.9 MPa from 99.3 MPa by inserting the Mo interlayer. When tested at 800 °C, the average three-point bend strength of the joints was improved to 120.1 MPa, nearly twice of that without Mo interlayer.