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Low cost microwave thick film structures
- Source :
- Journal of Materials Science: Materials in Electronics. 16:309-313
- Publication Year :
- 2005
- Publisher :
- Springer Science and Business Media LLC, 2005.
-
Abstract
- This paper examines the potential use of low cost materials and processes to produce thick film structures at low microwave frequencies. It examines empirically the upper frequency limits for the use of simple design techniques as a function of substrate thickness. It concludes that satisfactory results can be obtained using low cost methods up to about 12 GHz for 1 mm 96% alumina substrates and 16 GHz for 0.63 mm substrates. These are the most commonly available thick film substrate thicknesses. A low permittivity protective layer is desirable to maintain reliability.
- Subjects :
- Permittivity
Materials science
business.industry
Manufacturing process
Low-k dielectric
Substrate (electronics)
Condensed Matter Physics
Atomic and Molecular Physics, and Optics
Manufacturing cost
Electronic, Optical and Magnetic Materials
Reliability (semiconductor)
Optoelectronics
Electrical and Electronic Engineering
business
Layer (electronics)
Microwave
Subjects
Details
- ISSN :
- 1573482X and 09574522
- Volume :
- 16
- Database :
- OpenAIRE
- Journal :
- Journal of Materials Science: Materials in Electronics
- Accession number :
- edsair.doi...........81c9799128e5234727c5b29b5495773c