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New Method to Perform TDDB Tests for Hybrid Bonding Interconnects

Authors :
B. Ayoub
S. Moreau
S. Lhostis
P. Lamontagne
H. Combeau
J. G. Mattei
H. Fremont
Source :
2022 IEEE International Reliability Physics Symposium (IRPS).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 IEEE International Reliability Physics Symposium (IRPS)
Accession number :
edsair.doi...........813f3e6474e4b7cfe258cbdbd3cd0420
Full Text :
https://doi.org/10.1109/irps48227.2022.9764446
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