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Influence of poly (dihydroxybiphenyl borate) on the curing behaviour and thermal pyrolysis mechanism of phenolic resin
- Source :
- Polymer Degradation and Stability. 144:378-391
- Publication Year :
- 2017
- Publisher :
- Elsevier BV, 2017.
-
Abstract
- In this study, phenolic resin (PR) that is modified with poly (dihydroxybiphenyl borate) (PDDB) is prepared. The chemical structure, thermal properties and structural evolution at high temperatures for cured PDDB/PR are investigated to understand the reason for high char yields. The results show that the phenylborates that are formed during curing are attributed to the high char yield of PDDB/PR (74%, 800 °C). Phenylborates can block parts of phenolic hydroxyl and effectively inhibit their thermal decomposition reaction. By tracking the resin residue and volatiles that are released during pyrolysis, it is determined that boron oxide and boron carbide are formed via pyrolysis and help reduce carbon loss. Introducing PDDB into PR improves the graphitization degree and graphite crystallites of carbonization products, which promotes the formation of ordered glassy carbon during pyrolysis. Additionally, the CF/PDDB/PR composites show excellent mechanical and ablation properties due to good interfacial adhesion between resin matrix and fibre. This method makes it possible for using PDDB to enhance the thermal properties of the polymer with lower cost, more functions and broader applications.
- Subjects :
- Materials science
Polymers and Plastics
Carbonization
Thermal decomposition
chemistry.chemical_element
02 engineering and technology
Glassy carbon
010402 general chemistry
021001 nanoscience & nanotechnology
Condensed Matter Physics
01 natural sciences
0104 chemical sciences
chemistry
Chemical engineering
Mechanics of Materials
Boron oxide
Materials Chemistry
Organic chemistry
Char
0210 nano-technology
Boron
Pyrolysis
Curing (chemistry)
Subjects
Details
- ISSN :
- 01413910
- Volume :
- 144
- Database :
- OpenAIRE
- Journal :
- Polymer Degradation and Stability
- Accession number :
- edsair.doi...........80ac7426fdb0003877a11f1e609e12e2