Cite
Significant enhancement of thermal conductivity and EMI shielding performance in PEI composites via constructing 3D microscopic continuous filler network
MLA
Junyu Zhao, et al. “Significant Enhancement of Thermal Conductivity and EMI Shielding Performance in PEI Composites via Constructing 3D Microscopic Continuous Filler Network.” Colloids and Surfaces A: Physicochemical and Engineering Aspects, vol. 665, May 2023, p. 131222. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........80a4631cd53f6e4a3736427b48f25a24&authtype=sso&custid=ns315887.
APA
Junyu Zhao, Chunbo Wang, Chengyang Wang, Lan Yang, Bing Cong, Ke Zhang, Xiaogang Zhao, & Chunhai Chen. (2023). Significant enhancement of thermal conductivity and EMI shielding performance in PEI composites via constructing 3D microscopic continuous filler network. Colloids and Surfaces A: Physicochemical and Engineering Aspects, 665, 131222.
Chicago
Junyu Zhao, Chunbo Wang, Chengyang Wang, Lan Yang, Bing Cong, Ke Zhang, Xiaogang Zhao, and Chunhai Chen. 2023. “Significant Enhancement of Thermal Conductivity and EMI Shielding Performance in PEI Composites via Constructing 3D Microscopic Continuous Filler Network.” Colloids and Surfaces A: Physicochemical and Engineering Aspects 665 (May): 131222. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........80a4631cd53f6e4a3736427b48f25a24&authtype=sso&custid=ns315887.