Back to Search
Start Over
On Tolerating Faults of TSV/Microbumps for Power Delivery Networks in 3D IC
- Source :
- ISVLSI
- Publication Year :
- 2017
- Publisher :
- IEEE, 2017.
-
Abstract
- In 3DIC design, we may face the problem in manufacturing faults of through silicon vias (TSVs) and microbumps, and it will cause insufficient power delivery and eventually result in fatal error of functioning. In this work, we propose a power TSV/microbump fault tolerance scheme to resolve this issue. First, we use a fast heuristic to predict the worst IR-drop distribution under a given faulty rate by analyzing power simulation results. Next, we use an incremental repair method to enhance power delivery network until reaching the given target IR-drop. The experimental results show that our methodology is effective in power delivery network enhancement in TSV/microbump DFM.
- Subjects :
- 010302 applied physics
Engineering
Heuristic (computer science)
business.industry
Three-dimensional integrated circuit
Fault tolerance
Power simulation
Hardware_PERFORMANCEANDRELIABILITY
02 engineering and technology
Repair method
01 natural sciences
Maintenance engineering
020202 computer hardware & architecture
Power (physics)
Reliability engineering
Design for manufacturability
0103 physical sciences
Hardware_INTEGRATEDCIRCUITS
0202 electrical engineering, electronic engineering, information engineering
Electronic engineering
business
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2017 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)
- Accession number :
- edsair.doi...........80539180c43a4be867bfb1a8f6a6508f