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The Injection Mold Design of Clamshell Phone Upper Cover
- Source :
- Advanced Materials Research. :3127-3131
- Publication Year :
- 2014
- Publisher :
- Trans Tech Publications, Ltd., 2014.
-
Abstract
- The design of injection die on the upper cover of clamshell phone is introduced. The dual-plate die has side gate for opposite glue injection, the parts are ejected by ejector pin, the side reversed buckle contains three blocks, the reversed buckle at flip shaft consists of two inner sliders, and all the eight inner reversed buckles are made up of inclined pushing rods, and the cooling system embraces "U" shaped cooling waterway. Its application in practice has proved the reasonable die structure, smooth remolding, and qualified plastic part design.
Details
- ISSN :
- 16628985
- Database :
- OpenAIRE
- Journal :
- Advanced Materials Research
- Accession number :
- edsair.doi...........7f2d93804f4c2365674a23bc83c226ad