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The Injection Mold Design of Clamshell Phone Upper Cover

Authors :
Guo Dong Liang
Jun Hui Liu
Source :
Advanced Materials Research. :3127-3131
Publication Year :
2014
Publisher :
Trans Tech Publications, Ltd., 2014.

Abstract

The design of injection die on the upper cover of clamshell phone is introduced. The dual-plate die has side gate for opposite glue injection, the parts are ejected by ejector pin, the side reversed buckle contains three blocks, the reversed buckle at flip shaft consists of two inner sliders, and all the eight inner reversed buckles are made up of inclined pushing rods, and the cooling system embraces "U" shaped cooling waterway. Its application in practice has proved the reasonable die structure, smooth remolding, and qualified plastic part design.

Details

ISSN :
16628985
Database :
OpenAIRE
Journal :
Advanced Materials Research
Accession number :
edsair.doi...........7f2d93804f4c2365674a23bc83c226ad