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Quasi-Lumped Analysis of Wideband Bandpass Filter With High Out-of-Band Rejection Rate
- Source :
- IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:1549-1558
- Publication Year :
- 2019
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2019.
-
Abstract
- In this paper, a wideband bandpass filter (BPF) is proposed with three transmission zeros (TZs) that are created using immittance inverters. Impedance- (K-) and admittance- (J-) inverters are integrated with the high-pass and low-pass sections, respectively, and both sections are integrated to obtain a bandpass response. Controllable TZs are created near the passband for improving the skirt factor (SF). For the theoretical investigation and validation, a lumped equivalent circuit model of the proposed BPF is extracted with the quasi-lumped element techniques. The simulation results of electromagnetic (EM)/distributed model, equivalent lumped circuit model, and measured results of fabricated prototype BPF are in good agreement. Fabricated EM/distributed BPF has a center frequency of 2.17 GHz, with a fractional bandwidth of 67.3% (1.4–2.9 GHz). The measured insertion loss and group delay at the center frequency are 0.57 dB and 5.91 ns, respectively. A high SF of 0.97 is achieved at both the cutoff frequencies with the compact physical circuit size 20.5 $\text {mm} \times 28$ mm and normalized circuit size $0.24\lambda _{g} \times 0.33\lambda _{g}$ .
- Subjects :
- Physics
020208 electrical & electronic engineering
020206 networking & telecommunications
02 engineering and technology
Topology
Industrial and Manufacturing Engineering
Cutoff frequency
Electronic, Optical and Magnetic Materials
Band-pass filter
Immittance
0202 electrical engineering, electronic engineering, information engineering
Equivalent circuit
Insertion loss
Electrical and Electronic Engineering
Wideband
Center frequency
Passband
Subjects
Details
- ISSN :
- 21563985 and 21563950
- Volume :
- 9
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Accession number :
- edsair.doi...........7e5030d7a3b550187973a7be6f6ee005