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27.3: Synergistic Improvement of Photoresistance Adhesion for Cu Triple‐Layer Structure

Authors :
Hu Xiaobo
Conglong Zhang
Jian Liu
Linfeng Liu
Minli Tan
Jing Zhang
Source :
SID Symposium Digest of Technical Papers. 52:175-176
Publication Year :
2021
Publisher :
Wiley, 2021.

Subjects

Subjects :
Materials science
Chemical engineering
Triple layer
Plasma treatment
Adhesion

Details

ISSN :
21680159 and 0097966X
Volume :
52
Database :
OpenAIRE
Journal :
SID Symposium Digest of Technical Papers
Accession number :
edsair.doi...........7ca16dbdc525f45271759672dac2f5cb

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