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The evolution on the microstructure and thermal expansion behavior of Al–50Si alloy with different P contents
- Source :
- Journal of Materials Science: Materials in Electronics. 30:6786-6794
- Publication Year :
- 2019
- Publisher :
- Springer Science and Business Media LLC, 2019.
-
Abstract
- In the previous work, the Al–50Si alloy with fine primary Si is prepared by a low-cost technology. In addition, the morphology of primary Si and the metamorphic mechanism as well as the thermal expansibility of alloy are also investigated in this work. The mean size of primary Si can obtain the min value of 33.82 µm when the content of modifier is 3%. The thermal expansibility of alloy decreases with the increasing of modifier. The influence of microstructure, solid solubility as well as porosity on the thermal expansibility are also studied in this research. Moreover, several theoretical models such as ROM model, Turner model, Kerner model and Schapery model are also used to predict the coefficient of thermal expansion (CTE) of alloy.
- Subjects :
- 010302 applied physics
Work (thermodynamics)
Morphology (linguistics)
Materials science
Alloy
Theoretical models
engineering.material
Condensed Matter Physics
Microstructure
01 natural sciences
Atomic and Molecular Physics, and Optics
Thermal expansion
Electronic, Optical and Magnetic Materials
0103 physical sciences
Thermal
engineering
Electrical and Electronic Engineering
Composite material
Porosity
Subjects
Details
- ISSN :
- 1573482X and 09574522
- Volume :
- 30
- Database :
- OpenAIRE
- Journal :
- Journal of Materials Science: Materials in Electronics
- Accession number :
- edsair.doi...........7ae69c06834bd39079ba7a5951f4ccf6
- Full Text :
- https://doi.org/10.1007/s10854-019-00990-1