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The evolution on the microstructure and thermal expansion behavior of Al–50Si alloy with different P contents

Authors :
Guangming Xu
Bowen Wei
Liangliang Luo
Chuang Yu
Tao Jiang
Jinyu Fu
Shiju Li
Source :
Journal of Materials Science: Materials in Electronics. 30:6786-6794
Publication Year :
2019
Publisher :
Springer Science and Business Media LLC, 2019.

Abstract

In the previous work, the Al–50Si alloy with fine primary Si is prepared by a low-cost technology. In addition, the morphology of primary Si and the metamorphic mechanism as well as the thermal expansibility of alloy are also investigated in this work. The mean size of primary Si can obtain the min value of 33.82 µm when the content of modifier is 3%. The thermal expansibility of alloy decreases with the increasing of modifier. The influence of microstructure, solid solubility as well as porosity on the thermal expansibility are also studied in this research. Moreover, several theoretical models such as ROM model, Turner model, Kerner model and Schapery model are also used to predict the coefficient of thermal expansion (CTE) of alloy.

Details

ISSN :
1573482X and 09574522
Volume :
30
Database :
OpenAIRE
Journal :
Journal of Materials Science: Materials in Electronics
Accession number :
edsair.doi...........7ae69c06834bd39079ba7a5951f4ccf6
Full Text :
https://doi.org/10.1007/s10854-019-00990-1