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Optimal wiring topology for electromigration avoidance considering multiple layers and obstacles

Authors :
Iris Hui-Ru Jiang
Hua-Yu Chang
Chih-Long Chang
Source :
ISPD
Publication Year :
2010
Publisher :
ACM, 2010.

Abstract

Due to excessive current densities, electromigration may trigger a permanent open- or short-circuit failure in signal wires or power networks in analog or mixed-signal circuits. As the feature size keeps shrinking, this effect becomes a key reliability concern. Hence, in this paper, we focus on wiring topology generation for avoiding electromigration at the routing stage. Prior works tended towards heuristics; on the contrary, we first claim this problem belongs to class P instead of class NP-hard. Our breakthrough is, via the proof of the greedy-choice property, we successfully model this problem on a multi-source multi-sink flow network and then solve it by a strongly polynomial time algorithm. Experimental results prove the effectiveness and efficiency of our algorithm.

Details

Database :
OpenAIRE
Journal :
Proceedings of the 19th international symposium on Physical design
Accession number :
edsair.doi...........7823c4afdc80395e91134b5eb0a9abfb