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Process-Independent, Ultrasound-Enhanced, Electrostatic Batch Assembly
- Source :
- TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference.
- Publication Year :
- 2007
- Publisher :
- IEEE, 2007.
-
Abstract
- This paper describes a batch assembly method for 3D microsystems that is based on combining electrostatic forces and ultrasonic actuation. Simplicity of the setup, applicability to a broad range of surface micromachining processes, and the lack of any additional fabrication steps or exotic materials are the foremost advantages of this method. These attributes distinguish it from other popular assembly methods that rely on surface tension, magnetic coatings, robotics, etc.
Details
- Database :
- OpenAIRE
- Journal :
- TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference
- Accession number :
- edsair.doi...........77b735f3fe4dd7af13008469436755f0