Cite
Electromigration behavior of lead-free solder flip chip bumps on NiP/Cu metallization
MLA
D. R. Frear, et al. “Electromigration Behavior of Lead-Free Solder Flip Chip Bumps on NiP/Cu Metallization.” Journal of Applied Physics, vol. 103, June 2008, p. 123506. EBSCOhost, https://doi.org/10.1063/1.2940133.
APA
D. R. Frear, L. N. Ramanathan, & J. W. Jang. (2008). Electromigration behavior of lead-free solder flip chip bumps on NiP/Cu metallization. Journal of Applied Physics, 103, 123506. https://doi.org/10.1063/1.2940133
Chicago
D. R. Frear, L. N. Ramanathan, and J. W. Jang. 2008. “Electromigration Behavior of Lead-Free Solder Flip Chip Bumps on NiP/Cu Metallization.” Journal of Applied Physics 103 (June): 123506. doi:10.1063/1.2940133.