Physical design and verification of 3D reversible ALU by QCA technology

The “Quantum Dot Cellular Automata” or QCA is mainly used to design and simulate ‘3D’ structures for area-occupation, latency and total power reduction of any electronic circuit. At present, this “Nano-technology world” requires less-complex, small-size, high-frequency, fault-tolerant, low-power devices to increase the component-density in a single die. QCA designs are the well-known and optimum alternative of CMOS designs due to its above mentioned advantages. Further, reversible gates can also be formed based on QCA design. Reversible logic not only reduce the complexity of the design but also it can increase the information storage possibility by saving the power and energy. It is capable of reducing the leakage power (‘KTln2’ amount of dissipated energy for every bit can be ignored due to this logic). Cost of any device depends on the delay, power and occupied-area of the device which can be decreased by reversible multilayer (‘3D’) QCA structures. So, this proposed technique has an ability to provide the design for a cost-effective electronic device with good scalability and fault-tolerance. In the present work, we have simulated of an “Arithmetic and Logic Unit” in “QCA Designer” and “Xilinx” software. The first software is used due to the above advantages and here we apply reversible logic (reversible TSG gate with reversible AND-OR gate). This ALU is capable of performing one arithmetic (addition of two inputs) and three logical operations (AND, OR and XOR operations of two inputs) at a time. The TSG gate is used here as a full-adder with two input XOR operation and The reversible AND-OR gate is utilized for getting the AND result and OR result of two inputs. This design is also required a “4:1 MUX” which helps to select the operations properly. Schematic designs of proposed design with calculated values of delay and total power (for different room-temperature) are achieved in our work by using ‘Xilinx’ simulator. The used Verilog coding of our formed-design is also implemented in a “FPGA Board” (“Spartan 3E”) for hardware verification. Our presented circuitry can also continue its functionalities at high-temperature.