Back to Search
Start Over
Nail-like Cu2S nanoarrays with a partial interconnected structure synthesized on Cu foam for high-performance asymmetric supercapacitors
- Source :
- Journal of Materials Science: Materials in Electronics. 32:21770-21779
- Publication Year :
- 2021
- Publisher :
- Springer Science and Business Media LLC, 2021.
-
Abstract
- Transition metal sulfides have been extensively applied to the electrode materials of supercapacitors for its intrinsic high capacitance, low electronegativity, low cost, and outstanding conductivity. However, the common vulcanization processes for preparing electrode materials of transition metal sulfides are generally time-consuming (nearly 10–24 h) and inseparable from high-temperature heat treatment (nearly 200–400 °C). In this paper, we introduce a rapid room temperature process with direct sulfuration (4 h) of precursors without additional preheating treatment steps to prepare the nail-like Cu2S nanoarrays with a partial interconnected structure on copper foam (Cu2S/Cu). As the electrode of supercapacitors, the Cu2S/Cu reveals good capacitance performance (1219 F g−1 at 5 mA cm−2) and outstanding cycling stability (92% retained after 5000 cycles at 30 mA cm−2). These superior electrochemical performances may be mainly due to the fact that the nail-like Cu2S nanoarrays with a partial interconnected structure will provide efficient transport pathways for both electrons and ions along the longitudinal axis of the one-dimensional nanostructure.
- Subjects :
- Supercapacitor
Nanostructure
Materials science
chemistry.chemical_element
Conductivity
Condensed Matter Physics
Electrochemistry
Copper
Capacitance
Atomic and Molecular Physics, and Optics
Electronic, Optical and Magnetic Materials
Transition metal
chemistry
Chemical engineering
Electrode
Electrical and Electronic Engineering
Subjects
Details
- ISSN :
- 1573482X and 09574522
- Volume :
- 32
- Database :
- OpenAIRE
- Journal :
- Journal of Materials Science: Materials in Electronics
- Accession number :
- edsair.doi...........759839d3d5afce58a6d5780c2a26ecf8
- Full Text :
- https://doi.org/10.1007/s10854-021-06698-5