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Problems on Three-Dimensional Thermo-Fluid Simulation around Semiconductor Packages and Trends on Compact Thermal Model Development of Semiconductor Packages

Authors :
Koji Nishi
Source :
Journal of The Japan Institute of Electronics Packaging. 25:577-582
Publication Year :
2022
Publisher :
Japan Institute of Electronics Packaging, 2022.

Subjects

Subjects :
Electrical and Electronic Engineering

Details

ISSN :
1884121X and 13439677
Volume :
25
Database :
OpenAIRE
Journal :
Journal of The Japan Institute of Electronics Packaging
Accession number :
edsair.doi...........75084b8afb618f2c085fec739bedd6da
Full Text :
https://doi.org/10.5104/jiep.25.577
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