A Sectioning Technique for Demountable Semiconductor Samples

A sectioning technique is developed to circumvent problems associated with the conventional procedure. The new technique consists of wax mounting the sample in a suitable chuck followed by chemical-mechanical polishing using Nalcog slurry. Basic features of a chuck design and polishing characteristics, and some results of defect analysis of thin silicon sheets, afforded by this technique are briefly described. 1 ref.