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Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing
- Source :
- Tribology International. 105:37-41
- Publication Year :
- 2017
- Publisher :
- Elsevier BV, 2017.
-
Abstract
- In this study, a specially designed carrier with a one-zone pneumatic loading system that uses a thick copper disk as the workpiece was developed. Comparative studies of the fluid pressure and workpiece orientation between the disk and wafer carriers during chemical mechanical polishing were conducted. The results reveal that the copper disk leans down toward the leading edge and produces a negative-dominated (approximately 70%) fluid pressure, which differs from the multi-zone carrier but agrees with other studies in which the fluid pressure is measured from the disk side. Different balancing statuses and wedged gaps are formed in these two structures.
- Subjects :
- Leading edge
Materials science
business.industry
Mechanical Engineering
chemistry.chemical_element
Fluid bearing
02 engineering and technology
Surfaces and Interfaces
Structural engineering
021001 nanoscience & nanotechnology
Copper
Surfaces, Coatings and Films
020303 mechanical engineering & transports
0203 mechanical engineering
chemistry
Mechanics of Materials
Chemical-mechanical planarization
Orientation (geometry)
Wafer
Composite material
0210 nano-technology
business
Fluid pressure
Subjects
Details
- ISSN :
- 0301679X
- Volume :
- 105
- Database :
- OpenAIRE
- Journal :
- Tribology International
- Accession number :
- edsair.doi...........736b7486ab4e2ac7b035a9518628ff4c
- Full Text :
- https://doi.org/10.1016/j.triboint.2016.09.019