Cite
Investigation on out-of-plane displacement measurements of thin films via a mechanical constraint-based 3D-DIC technique
MLA
Lu Wang, et al. “Investigation on Out-of-Plane Displacement Measurements of Thin Films via a Mechanical Constraint-Based 3D-DIC Technique.” Optics Communications, vol. 530, Mar. 2023, p. 129015. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........72989cd51be5f62a772a935ced5437d6&authtype=sso&custid=ns315887.
APA
Lu Wang, Guangyan Liu, Yawen Deng, Wenzhang Sun, Qinwei Ma, & Shaopeng Ma. (2023). Investigation on out-of-plane displacement measurements of thin films via a mechanical constraint-based 3D-DIC technique. Optics Communications, 530, 129015.
Chicago
Lu Wang, Guangyan Liu, Yawen Deng, Wenzhang Sun, Qinwei Ma, and Shaopeng Ma. 2023. “Investigation on Out-of-Plane Displacement Measurements of Thin Films via a Mechanical Constraint-Based 3D-DIC Technique.” Optics Communications 530 (March): 129015. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi...........72989cd51be5f62a772a935ced5437d6&authtype=sso&custid=ns315887.