Investigation of the Influence of Plating Additives on Lattice Defects in Electrolytic Copper Using Positron Annihilation Technique

The influence of plating additives on lattice defects in electrolytic copper made with various amount of plating additives has been investigated by positron annihilation technique. The results show that the copper plated with no leveler and normal amount of brightener includes vacancy clusters corresponding to positron lifetime of about 330 ps. On the other hand, the other samples have no remarkable vacancy clusters. These suggest that plating additives influence not only on the copper surface morphology but also on the formation of the microscopic lattice defects.