A study of characterizing crosstalk effects in 3-D vias

This paper reports on 3-D Via crosstalk characterization in three-dimensional integrated circuits. Several physical and environmental configurations are investigated using a 3D electromagnetic field solver. In particular, this work shows a detailed study on the influence of signal-ground 3D-Via locations, distances and their structural configurations on crosstalk. Simulation results are presented using HFSS from Ansoft Corporation and based on the MIT Lincoln Lab for the 0.15μm 3DFDSO1 process technology.