Reliability Performance of Stretch Solder Interconnections

Authors :: S.S. Lim
Ee Hua Wong
Ranjan Rajoo
W.Y. Hnin
Source :: 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
Publication Year :: 2006
Publisher :: IEEE, 2006.
Abstract: A wafer level packaging technique has been developed with an inherent advantage of excellent solder joint co-planarity essential for wafer level test and burn-in. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced by stretching the solder joint to achieve high aspect ratio and small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder joints has been found to be considerably better than that of the conventional spherical-shaped solder bumps.

Subjects :: Fabrication
Materials science
Reliability (semiconductor)
Soldering
Electronic engineering
Wafer
Temperature cycling
Integrated circuit packaging
Wave soldering
Composite material
Wafer-level packaging

ISSN :: 10898190
Database :: OpenAIRE
Journal :: 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium
Accession number :: edsair.doi...........706ba54d2e2336d6232803d71d949406
Full Text :: https://doi.org/10.1109/iemt.2006.4456430