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An opto-electronic multi-chip module for chip-scale interconnects

Authors :
B. Campos
Joseph N. Mait
Dennis W. Prather
Fouad Kiamilev
M.R. LeCompte
George J. Simonis
S. Venkataraman
Source :
Technical Digest. Summaries of papers presented at the Conference on Lasers and Electro-Optics. Postconference Technical Digest (IEEE Cat. No.01CH37170).
Publication Year :
2001
Publisher :
IEEE, 2001.

Abstract

Summary form only given. We have demonstrated an integrated optoelectronic MCM that uses a glass substrate as a mechanical carrier for the VCSEL, VCSEL driver, and diffractive element. Over a distance a little longer than 1 mm, our system fanned-out a single VCSEL into 60 individual fan-outs.

Details

Database :
OpenAIRE
Journal :
Technical Digest. Summaries of papers presented at the Conference on Lasers and Electro-Optics. Postconference Technical Digest (IEEE Cat. No.01CH37170)
Accession number :
edsair.doi...........6ee3ae747edc65af2f9bd93b7b31f9b2
Full Text :
https://doi.org/10.1109/cleo.2001.947436