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Sputter deposition of copper oxide films
- Source :
- Applied Surface Science. 492:711-717
- Publication Year :
- 2019
- Publisher :
- Elsevier BV, 2019.
-
Abstract
- Copper oxide thin films are grown by reactive magnetron sputter deposition. To define the parameter space to obtain CuO films, the influence of the oxygen partial pressure, the total pressure, and the discharge current was investigated on the phase formation. A clear change from pure copper, over cuprite (Cu 2 O), and paramelaconite (Cu 4 O 3 ) to tenorite (CuO) thin films with increasing oxygen partial pressure was observed using X-ray diffraction and Fourier transform infrared spectroscopy. The main driving force defining the phase composition is the oxygen partial pressure, while the influence of the total pressure, and the discharge current is minimal. A clear condition to obtain phase pure CuO films could be defined based on the measured discharge voltage. Both the domain size, and the Bragg peak position for pure CuO thin films can be correlated to the negative ion bombardment during film growth.
- Subjects :
- Copper oxide
Cuprite
Materials science
Analytical chemistry
General Physics and Astronomy
chemistry.chemical_element
02 engineering and technology
engineering.material
010402 general chemistry
01 natural sciences
chemistry.chemical_compound
Thin film
Total pressure
Surfaces and Interfaces
General Chemistry
Partial pressure
Sputter deposition
Paramelaconite
021001 nanoscience & nanotechnology
Condensed Matter Physics
Copper
0104 chemical sciences
Surfaces, Coatings and Films
chemistry
visual_art
engineering
visual_art.visual_art_medium
0210 nano-technology
Subjects
Details
- ISSN :
- 01694332
- Volume :
- 492
- Database :
- OpenAIRE
- Journal :
- Applied Surface Science
- Accession number :
- edsair.doi...........6e0cefe3303e3d34a6c1cb8e9736dcdf
- Full Text :
- https://doi.org/10.1016/j.apsusc.2019.06.263