Advancing the thermal stability of 3D ICs using logi-thermal simulation

MLA

Andras Poppe, et al. “Advancing the Thermal Stability of 3D ICs Using Logi-Thermal Simulation.” Microelectronics Journal, vol. 46, Dec. 2015, pp. 1114–20. EBSCOhost, https://doi.org/10.1016/j.mejo.2015.06.025.

APA

Andras Poppe, László Pohl, Gergely N. Nagy, & Peter Horvath. (2015). Advancing the thermal stability of 3D ICs using logi-thermal simulation. Microelectronics Journal, 46, 1114–1120. https://doi.org/10.1016/j.mejo.2015.06.025

Chicago

Andras Poppe, László Pohl, Gergely N. Nagy, and Peter Horvath. 2015. “Advancing the Thermal Stability of 3D ICs Using Logi-Thermal Simulation.” Microelectronics Journal 46 (December): 1114–20. doi:10.1016/j.mejo.2015.06.025.