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Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment

Authors :
Murugesan Mariappan
Shizu Fukuzumi
Tomoaki Shibata
Hiroyuki Hashimoto
JiChel Bea
Mitsumasa Koyanagi
Takafumi Fukushima
Source :
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
Accession number :
edsair.doi...........6d24ee183a471528e1c125af7594fd34

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