Materials Engineering for Future Interconnects: 'Catalyst-Free' Electroless Cu Deposition on Self-Assembled Monolayer Alternative Barriers

MLA

A. Maestre Caro, and Silvia Armini. “Materials Engineering for Future Interconnects: ‘Catalyst-Free’ Electroless Cu Deposition on Self-Assembled Monolayer Alternative Barriers.” Journal of The Electrochemical Society, vol. 157, Jan. 2010, p. D74. EBSCOhost, https://doi.org/10.1149/1.3258026.

APA

A. Maestre Caro, & Silvia Armini. (2010). Materials Engineering for Future Interconnects: “Catalyst-Free” Electroless Cu Deposition on Self-Assembled Monolayer Alternative Barriers. Journal of The Electrochemical Society, 157, D74. https://doi.org/10.1149/1.3258026

Chicago

A. Maestre Caro, and Silvia Armini. 2010. “Materials Engineering for Future Interconnects: ‘Catalyst-Free’ Electroless Cu Deposition on Self-Assembled Monolayer Alternative Barriers.” Journal of The Electrochemical Society 157 (January): D74. doi:10.1149/1.3258026.