Electrohydrodynamic Direct-Write Multi-Layer Micro Circuit on Flexible Substrate

Electrohydrodynamic Direct-Writing (EDW) provides a simple and rapid way to print micro/nanostructures from viscoelastic solution, which meets the demand in the development of all-printed organic electronics. Overlapped printing of different functional materials to build up multi-layer devices displays excellent advantages in the flexible electron. The 3D multi-layer devices as well as flat interconnection can be fabricated on the flexible substrate directly via EDW technology. The technology of EDW utilized stable charged jet to print orderly conductive and insulator micro/nanostructure. Silver ink is used to print conductor connection, and polyvinylpyrrolidone (PVP) solution is used to fabricate insulator layer. Multi-layer interconnection can be printed layer by layer on the polyimide (PI) flexible insulator substrate. The resistance of top and bottom conductor connection was 6.1Ω and 5.9Ω, respectively. The insulator layer demonstrated excellent insulation characteristics between the bottom and top silver interconnection.