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Influence of Cu Addition on the Transient Creep Characteristics of Sn–9Zn-1.5Ag Solder Alloy

Authors :
Mahmoud Youssef Salem
Source :
American Research Journal of Physics. 6:1-11
Publication Year :
2020
Publisher :
American Research Journals, 2020.

Subjects

Subjects :
Materials science
Creep
General Materials Science
Transient (oscillation)
Composite material
Solder alloy

Details

ISSN :
23805714
Volume :
6
Database :
OpenAIRE
Journal :
American Research Journal of Physics
Accession number :
edsair.doi...........6a969d33b09ee7e97adde4bb29738838
Full Text :
https://doi.org/10.21694/2380-5714.20001
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