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A 0.35 ¿m SiGe BiCMOS Technology for Power Amplifier Applications

Authors :
J. Dunn
Qizhi Liu
Ramana M. Malladi
Peter B. Gray
Ping-Chuan Wang
Kenneth J. Stein
Douglas B. Hershberger
R. Previti-Kelly
Panglijen Candra
Ephrem G. Gebreselasie
Benjamin T. Voegeli
K. Watson
Wade J. Hodge
Peter J. Lindgren
Zhong-Xiang He
Alvin J. Joseph
Source :
2007 IEEE Bipolar/BiCMOS Circuits and Technology Meeting.
Publication Year :
2007
Publisher :
IEEE, 2007.

Abstract

In this paper we introduce, a state-of-the-art SiGe BiCMOS power amplifier technology that features two NPNs with 40 GHz / 6.0 V & 27 GHz / 8.5 V (fT - BVceo) respectively, a novel low inductance metal ground through-silicon-via (TSV), integrated on a low-cost 0.35 μm lithography node with 3.3 V / 5.0 V dual-gate CMOS technology and high-quality passives on a 50 Ω.cm substrate.

Details

ISSN :
10889299
Database :
OpenAIRE
Journal :
2007 IEEE Bipolar/BiCMOS Circuits and Technology Meeting
Accession number :
edsair.doi...........69f768941b9f07f9c4bc96f3507b0e97
Full Text :
https://doi.org/10.1109/bipol.2007.4351868