Dielectric and electrical properties of PANI composite films

The present work deals with the preparation of films from polymeric core-shell particles. Our approach is based on the chemical polymerization of a very thin layer of polyaniline (PANI) around particles of transparent polymers (polyamide and polystyrene). Films are then obtained by dissolving the two type synthesized core-shell powders in dichloromethane and m-Cresol respectively. Electrical properties were investigated using a dielectric relaxation spectrometer. Both composite films exhibited a percolative behaviour and a well established dc conductivity for high PANI concentration related to the conductive properties of the PANI spanning clusters. This property allows using such films in semi-conductive applications. For polyamide films, high dielectric constants were obtained at 5 wt. % of PANI allowing their use as high k-dielectrics compatibles with organic printed circuit boards.