Selective deposition of AlOx for Fully Aligned Via in nano Cu interconnects

MLA

K. Sharma, et al. “Selective Deposition of AlOx for Fully Aligned Via in Nano Cu Interconnects.” 2021 IEEE International Interconnect Technology Conference (IITC), July 2021. EBSCOhost, https://doi.org/10.1109/iitc51362.2021.9537315.

APA

K. Sharma, Thomas J. Haigh, Dennis M. Hausmann, James J. Demarest, Peethala Cornelius Brown, Paul C. Lemaire, James Chingwei Li, Arpan Mahorowala, Hosadurga Shobha, Hsiang-Jen Huang, Balasubramanian S. Pranatharthi Haran, Son V. Nguyen, & P. Ramani. (2021). Selective deposition of AlOx for Fully Aligned Via in nano Cu interconnects. 2021 IEEE International Interconnect Technology Conference (IITC). https://doi.org/10.1109/iitc51362.2021.9537315

Chicago

K. Sharma, Thomas J. Haigh, Dennis M. Hausmann, James J. Demarest, Peethala Cornelius Brown, Paul C. Lemaire, James Chingwei Li, et al. 2021. “Selective Deposition of AlOx for Fully Aligned Via in Nano Cu Interconnects.” 2021 IEEE International Interconnect Technology Conference (IITC), July. doi:10.1109/iitc51362.2021.9537315.