Impact of Pogo Probes on Charge Device Model (CDM) testing of Semiconductor Flip-Chip Packages

Charge Device Model (CDM) events contribute to most of the Electrostatic Discharge (ESD) failures of semiconductor devices in the field. One of the major components of a CDM tester is a grounded pogo pin/probe which is used to create a discharge path for the charged device. There are many device packages in the market, however, this paper will focus on the most common flip chip packages types in the industry - Ball Grid Array (BGA), Pin Grid Array (PGA) and Land Grid Array (LGA). Three pogo probe types will be used and are described in detail in the paper. This study recommends the best fit pogo probe tip type for each package type based on the magnitude and standard deviation of the discharge current. The results and statistical methods can be useful for all Reliability engineers in helping them to choose the most appropriate pogo probe type for the various packages. Choosing the right pin can increase the robustness and quality of CDM testing.