Foreword to the Special Issue 'Trends on Optical Circuit Packaging Technology'

Subjects

Subjects :

Engineering
Packaging engineering
business.industry
Electrical and Electronic Engineering
business
Manufacturing engineering

Details

ISSN :

1884121X and 13439677

Volume :

7

Database :

OpenAIRE

Journal :

Journal of Japan Institute of Electronics Packaging

Accession number :

edsair.doi...........66812bb0d15f6dda524fa5cf23df57f1

Full Text :

https://doi.org/10.5104/jiep.7.203